{"id":414,"date":"2018-03-06T17:07:40","date_gmt":"2018-03-06T16:07:40","guid":{"rendered":"https:\/\/tectron-worbis.de.46-4-53-222.vorschau.marketing-thom.de\/?page_id=414"},"modified":"2021-10-20T14:47:47","modified_gmt":"2021-10-20T12:47:47","slug":"smt-fertigung","status":"publish","type":"page","link":"https:\/\/www.tectron-worbis.de\/en\/produktion\/smt-fertigung\/","title":{"rendered":"SMT Production"},"content":{"rendered":"
In contrast to THT elements, SMD elements - i.e. surface-mounted devices - are soldered directly onto the printed circuit board as a flat assembly using solderable connection pads in SMT production processes. This eliminates the need for the through-contacting of wires, which is common in other variants. Our innovative SMT processes allow us to fully automate very dense and double-sided assembly of printed circuit boards, which significantly reduces the space required. Many small components on a reduced surface area thus lead to significantly smaller and also more cost-effective products.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
Our SMT production offers our customers the highest standard thanks to state-of-the-art machines and qualified skilled workers. In addition to many Mydata machines for small and sample series, various SMD lines - including five complete lines from the latest Siemens X series - are available 24 hours a day. Thanks to our countless projects from a wide variety of industries, we have succeeded in integrating many components that were previously assembled manually in the THT process into the SMD process. THR technology (Through-Hole Reflow) enables us to put together various assemblies even more effectively and economically.<\/p>
We also use the latest technology to determine the most suitable process sequences for each assembly in advance.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t SMT \u2013 das L\u00f6ten direkt auf der Leiterplatte Im Gegensatz zu den THT-Elementen, werden bei SMT-Fertigungsverfahren sogenannte SMD-Elemente \u2013 also Surface-Mount-Devices oder oberfl\u00e4chenmontierte Bauelemente \u2013 mithilfe l\u00f6tf\u00e4higer Anschlussfl\u00e4chen als Flachbaugruppe direkt auf die Leiterplatte gel\u00f6tet. Die bei anderen Varianten \u00fcbliche Durchkontaktierung von Dr\u00e4hten entf\u00e4llt also. Durch unsere innovativen SMT-Verfahren k\u00f6nnen wir vollautomatisiert eine sehr dichte […]<\/p>","protected":false},"author":1,"featured_media":0,"parent":412,"menu_order":10,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-414","page","type-page","status-publish","hentry"],"yoast_head":"\nThe advantages of SMT production<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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